| 图片 | 型号 | 制造商 | 描述 | 参考价格 | 库存数量 | 询价 |
|
|
|
|
CPU与芯片冷却器 Passive cooling solution for conga-IA5 based on open silicon Pentium and Celeron processors with 12mm heatsink fins.
PDF数据手册
|
暂无价格
|
参考库存:49579
|
|
|
|
|
|
CPU与芯片冷却器 Standard active cooling solution for COM Express modules conga-TC97, TC170 and TC175. All standoffs are M 2.5 threaded, 15mm fins, 18mm overall heat sink height and integrated 12V fan.
PDF数据手册
|
暂无价格
|
参考库存:49194
|
|
|
|
|
|
CPU与芯片冷却器 Standard active cooling solution for COM Express modules conga-TC97, TC170 and TC175. All standoffs are with 2.7mm bore hole, 15mm fins, 18mm overall heat sink height and integrated 12V fan.
PDF数据手册
|
暂无价格
|
参考库存:48954
|
|
|
|
|
|
CPU与芯片冷却器 Standard active cooling solution for high performance COM Express module conga-TR3 with integrated heat pipes, 15mm fins, 20mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole.
PDF数据手册
|
暂无价格
|
参考库存:48729
|
|
|
|
|
|
CPU与芯片冷却器 Standard active cooling solution for high performance COM Express module conga-TR4 with integrated heat pipes, 15mm fins, 20mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole.
PDF数据手册
|
暂无价格
|
参考库存:48397
|
|
|
|
|
|
CPU与芯片冷却器 Pico-ITX chassis with passive cooling for conga-PA5 with non-lidded Intel Celeron and Pentium processors with IO shield, LED's, power button, 2x USB 2.0, 2.5" HDD mount, 2x antenna holes, 1x UART hole, VESA mounting. Vendor: AKASA
PDF数据手册
|
暂无价格
|
参考库存:48392
|
|
|
|
|
|
CPU与芯片冷却器 Standard active cooling solution for high performance COM Express Basic Type 7 module conga-B7AC with integrated vapor chamber, 15mm fins, 20mm overall heat sink height and integrated 12V fan.Intended for modules with TDP higher than 17W * VC = vapor
PDF数据手册
|
暂无价格
|
参考库存:48167
|
|
|
|
|
|
CPU与芯片冷却器 Passive cooling solution for Qseven module conga-QMX8 with lidded NXP i.MX8 ARM Cortex A72 processor. All standoffs are M2.5mm thread.
PDF数据手册
|
暂无价格
|
参考库存:48137
|
|
|
|
|
|
CPU与芯片冷却器 Standard passive cooling solution for COM Express module conga-TC87 with 20mm high cooling fins. All stand-offs are 2.7mm bore hole.
PDF数据手册
|
暂无价格
|
参考库存:48127
|
|
|
|
|
|
CPU与芯片冷却器 Standard passive cooling solution for high performance COM Express module conga-TR4 with integrated heat pipes, 15mm fins and 20mm overall heat sink height. All standoffs are with 2.7mm bore hole.
PDF数据手册
|
暂无价格
|
参考库存:48097
|
|
|
|
|
|
CPU与芯片冷却器 Standard passive cooling solution for COM Express Basic Type 7 module conga-B7AC with integrated copper plate, 15mm fins and 20mm overall heat sink height. Intended for modules with TDP up to 17W * Cu = copper plate * B = Bore hole standoffs
PDF数据手册
|
暂无价格
|
参考库存:48072
|
|
|
|
|
|
CPU与芯片冷却器 Standard active cooling solution for high performance COM Express module conga-TR3 with integrated heat pipes, 15mm fins, 20mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread.
PDF数据手册
|
暂无价格
|
参考库存:48002
|
|
|
|
|
|
CPU与芯片冷却器 Standard passive cooling solution for COM Express modules conga-TC97, TC170 and TC175. All standoffs are with 2.7mm bore hole.
PDF数据手册
|
暂无价格
|
参考库存:47987
|
|
|
|
|
|
CPU与芯片冷却器 Standard active cooling solution for COM Express modules conga-TC87. All standoffs are M 2.5 threaded, 13mm fins, 23mm overall heat sink height and integrated 12V fan.
PDF数据手册
|
暂无价格
|
参考库存:47777
|
|
|
|
|
|
CPU与芯片冷却器 Standard active cooling solution for high performance COM Express module conga-TR4 with integrated heat pipes, 15mm fins, 20mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread.
PDF数据手册
|
暂无价格
|
参考库存:47487
|
|
|
|
|
|
CPU与芯片冷却器 Standard active cooling solution for COM Express Basic Type 7 module conga-B7AC with integrated copper plate, 15mm fins, 20mm overall heat sink height and integrated 12V fan. Intended for modules with TDP up to 17W * Cu = Copper plate * B = 2.7mm Bor
PDF数据手册
|
暂无价格
|
参考库存:47352
|
|
|
|
|
|
CPU与芯片冷却器 Standard passive cooling solution for high performance COM Express Basic Type 7 module conga-B7AC with integrated copper plate, 15mm fins and 20mm overall heat sink height. Intended for modules with TDP up to 17W * Cu = copper plate * T = M2.5 Thread
PDF数据手册
|
暂无价格
|
参考库存:47247
|
|
|
|
|
|
CPU与芯片冷却器 Standard active cooling solution for high performance COM Express Basic Type 7 module conga-B7AC with integrated vapor chamber, 15mm fins, 20mm overall heat sink height and integrated 12V fan. Intended for modules with TDP higher than 17W * VC = Vapo
PDF数据手册
|
暂无价格
|
参考库存:47142
|
|
|
|
|
|
CPU与芯片冷却器 Standard passive cooling solution for high performance COM Express module conga-TR3 with integrated heat pipes, 15mm fins and 20mm overall heat sink height. All standoffs are M2.5mm thread.
PDF数据手册
|
暂无价格
|
参考库存:47067
|
|
|
|
|
|
CPU与芯片冷却器 Standard passive cooling solution for COM Express module conga-TC87 with 20mm high cooling fins. All stand-offs are M2.5mm threaded.
PDF数据手册
|
暂无价格
|
参考库存:46982
|
|