| 图片 | 型号 | 制造商 | 描述 | 参考价格 | 库存数量 | 询价 |
|
|
|
|
CPU与芯片冷却器 Standard active cooling solution for COM Express Basic Type 7 module conga-B7AC with integrated copper plate, 15mm fins, 20mm overall heat sink height and integrated 12V fan. Intended for modules with TDP up to 17W * Cu = Copper plate * T = M2.5 thre
PDF数据手册
|
暂无价格
|
参考库存:46962
|
|
|
|
|
|
CPU与芯片冷却器 Standard active cooling solution for COM Express modules conga-TC87. All standoffs are with 2.7mm bore hole, 13mm fins, 23mm overall heat sink height and integrated 12V fan.
PDF数据手册
|
暂无价格
|
参考库存:46877
|
|
|
|
|
|
CPU与芯片冷却器 Standard active cooling solution for high performance COM Express Type 7 module conga-TSXD with integrated heat pipes, 70mm radial 12V PWM fan and 30mm overall heat sink height. All standoffs are with 2.7mm bore hole.
PDF数据手册
|
暂无价格
|
参考库存:46842
|
|
|
|
|
|
CPU与芯片冷却器 Passive cooling solution for conga-PA5 based on open silicon Pentium and Celeron processors and heat sink with 12mm heatsink fins. All standoffs are with 2.7 mm threaded hole.
PDF数据手册
|
暂无价格
|
参考库存:46762
|
|
|
|
|
|
CPU与芯片冷却器 Standard passive cooling solution for COM Express modules conga-TC97, TC170 and TC175. All standoffs are M 2.5 threaded
PDF数据手册
|
暂无价格
|
参考库存:46737
|
|
|
|
|
|
CPU与芯片冷却器 Standard passive cooling solution for high performance COM Express module conga-TR4 with integrated heat pipes, 15mm fins and 20mm overall heat sink height. All standoffs are M2.5mm thread.
PDF数据手册
|
暂无价格
|
参考库存:46642
|
|
|
|
|
|
CPU与芯片冷却器 Standard active cooling solution for high performance COM Express Type 7 module conga-TSXD with integrated heat pipes, 70mm radial 12V PWM fan and 30mm overall heat sink height. All standoffs are M2.5mm thread.
PDF数据手册
|
暂无价格
|
参考库存:46572
|
|
|
|
|
|
CPU与芯片冷却器 Passive cooling solution for conga-PA5 based on lidded Atom E3900 processors with 12mm heatsink fins. All standoffs are with 2.7 mm threaded hole.
PDF数据手册
|
暂无价格
|
参考库存:46477
|
|
|
|
|
|
CPU与芯片冷却器 Standard passive cooling solution for high performance COM Express Basic Type 7 module conga-B7AC with integrated vapor chamber, 15mm fins and 20mm overall heat sink height. Intended for modules with TDP higher than 17W * VC = Vapor Chamber * B = 2.7
PDF数据手册
|
暂无价格
|
参考库存:46327
|
|
|
|
|
|
CPU与芯片冷却器 Passive cooling solution for Qseven module conga-QMX8 with lidded NXP i.MX8 ARM Cortex A72 processor. All standoffs are with 2.7mm bore hole.
PDF数据手册
|
暂无价格
|
参考库存:46242
|
|
|
|
|
|
CPU与芯片冷却器 Standard passive cooling solution for high performance COM Express module conga-TR3 with integrated heat pipes, 15mm fins and 20mm overall heat sink height. All standoffs are with 2.7mm bore hole.
PDF数据手册
|
暂无价格
|
参考库存:46062
|
|
|
|
|
|
CPU与芯片冷却器 Standard passive cooling solution for high performance COM Express Basic Type 7 module conga-B7AC with integrated vapor chamber, 15mm fins and 20mm overall heat sink height. Intended for modules with TDP higher than 17W * VC= Vapor Chamber * T =M2.5
PDF数据手册
|
暂无价格
|
参考库存:46057
|
|
|
|
|
|
CPU与芯片冷却器 Passive cooling solution for conga-IA5 based on lidded Atom E3900 processors with 12mm heatsink fins.
PDF数据手册
|
暂无价格
|
参考库存:46002
|
|