| 图片 | 型号 | 制造商 | 分类 | 数据手册 | 描述 | 参考价格 | 库存数量 |
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散热片
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散热片 Board Level Extruded Heatsink for Leadless Chip Carriers, Flat Packs and 68 Position, Radial Fin Round, Horizontal/Vertical Mounting, 28.58x28.58x9.14mm
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暂无价格
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参考库存:33286
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散热片
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散热片 superGRIP Heatsink Assembly, Straight Fin, Low Profile, T766, Black-Anodized, 39.25x39.25x14.5mm
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100:¥107.4178
500:¥97.8919
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参考库存:33291
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散热片
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散热片 PASSIVE COOLING SOL conga-BAF 2.5mm
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暂无价格
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参考库存:33296
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散热片
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散热片 Passive cooling solution for COM Express module conga-TCA/CCA with 10mm fins. Fins rotated 45 degrees from standard. All standoffs are 2.7mm bore hole.
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暂无价格
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参考库存:33301
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散热片
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散热片 superGRIP Heatsink Assembly, Straight Fin, Low Profile, T766, Black-Anodized, 22.25x22.25x14.5mm
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100:¥98.1292
500:¥89.3604
1,000:¥87.5976
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参考库存:33306
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