| 图片 | 型号 | 制造商 | 分类 | 数据手册 | 描述 | 参考价格 | 库存数量 |
|
|
|
|
散热片
|
|
散热片 Chipset Heatsink with Clip, Pin Fin, 29mm Chip Size, 11.6mm Height, Aluminum, Black Anodized
|
暂无价格
|
参考库存:27714
|
|
|
|
|
散热片
|
|
散热片 Compression Mounting Clamp Assemblies for Semiconductors to 114.3mm Diameter, 120.7mm to 139.7mm, 228.6mm Height
|
暂无价格
|
参考库存:27719
|
|
|
|
|
散热片
|
|
散热片 SALEABLE PACKAGED V.
|
暂无价格
|
参考库存:27724
|
|
|
|
|
散热片
|
|
散热片 Chipset Heatsink with Clip, Elliptical, 21mm Chip Size, 22.6mm Height, Aluminum, Black Anodized
|
暂无价格
|
参考库存:27729
|
|
|
|
|
散热片
|
|
散热片 Standard active cooling solution for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes, 15mm silver fins, 21mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread.
|
暂无价格
|
参考库存:27734
|